Frank Gerner

Frank M Gerner

Senior Associate Dean

Engineering Research Cntr

816

CEAS - Administration - 0018

Research Support

Grant: #C-80063-A Investigators:Gerner, Frank 06-03-2003 -12-31-2003 National Aeronautics and Space Administration Micro Loop Heat Pipe Section Role:PI $79,999.00 Closed Level:Federal

Grant: #C80075A Investigators:Gerner, Frank 06-03-2003 -12-31-2003 National Aeronautics and Space Administration Interconnected Coherent Porous Silicon Role:PI $29,998.00 Closed Level:Federal

Grant: #NNC04CB44C INT.NCE Investigators:Gerner, Frank 09-03-2004 -03-31-2007 National Aeronautics and Space Administration Proof of Concept Micro Loop Pipe Role:PI $130,000.00 Closed Level:Federal

Grant: #L-14449 Investigators:Gerner, Frank 06-01-2001 -09-30-2001 National Aeronautics and Space Administration Development of Coherent Porous Silicon for a Loop Hear Pipe Role:PI $44,999.00 Closed Level:Federal

Grant: #SRS 5462 Investigators:Gerner, Frank 02-15-2008 -11-15-2011 Defense Advanced Research Projects Agency Thermal Ground Plane (TGP) Proposal Role:PI $172,099.00 Closed Level:Federal

Grant: #S007 Investigators:Gerner, Frank; Lim, Teik; Liu, Yijun 01-04-2010 -12-31-2011 TechnoSoft, Inc. Co-op Assignments at Technosoft Role:PI $225,000.00 Closed Level:Industry

Grant: #SRS 005781 Investigators:Gerner, Frank; Lim, Teik; Liu, Yijun 09-01-2008 -01-31-2018 Procter & Gamble Company High Performance Modeling and Simulation Center Role:PI $12,561,000.00 Active Level:Industry

Grant: #SRS 11017 Investigators:Gerner, Frank 10-05-2008 -05-01-2019 Procter & Gamble Company Procter & Gamble Simulation Center Master Agreement Role:PI $.00 Active Level:Industry

Grant: #Edaptive Master Agreement Investigators:Bhatnagar, Raj; Gerner, Frank 02-01-2018 -01-31-2025 EDAptive Computing, Incorporated Edaptive Computing Master Alliance Agreement Role:Collaborator $.00 Active Level:Industry

Grant: #Exh A-6 SETS02-UC/MAA-2018 - FA8650-14-D-1724/0002 Investigators:Bhatnagar, Raj; Gerner, Frank; Niu, Nan 05-26-2019 -08-24-2019 Air Force Research Laboratory Exhibit A-6: Application and research into Using SYSML as basis for vulnerability assessment Role:Collaborator $21,868.00 Awarded Level:Federal

Grant: #Exh A-7 STAMP01-UC/MAA-2018 / FA8650-18-F-1613 Investigators:Bhatnagar, Raj; Gerner, Frank; Minai, Ali 05-26-2019 -08-24-2019 Air Force Research Laboratory Exhibit A-7: Application and research into using ML analytics to evaluate/improve verification test processes and results Role:Collaborator $40,245.00 Awarded Level:Federal

Publications

Peer Reviewed Publications

Gerner F.; Remella K. (07-25-2017. )Parametric study of liquid-vapor interface within a woven metallic wire mesh screen.Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017, ,155-163

Gerner F.; Remella K. (04-01-2017. )Simplified Mathematical Model of a novel ‘Closed Loop Two-Phase Wicked Thermosyphon (CLTPWT)’.International Journal of Thermal Sciences, ,114 ,281-295

Gerner F.; Remella K. (01-01-2017. )False transient evaporator thermal model of the 'Closed Loop Two-Phase Wicked Thermosyphon (CLTPWT)'.Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering, ,

Gerner F.; Remella K. (04-22-2016. )In-plane effective thermal conductivity of a single layered metallic wire-mesh screen.Annual IEEE Semiconductor Thermal Measurement and Management Symposium, ,Part F121464 ,57-65

Anand S.; Gerner F.; Paul R. (01-01-2014. )Effect of thermal deformation on part errors in metal powder based additive manufacturing processes.Journal of Manufacturing Science and Engineering, Transactions of the ASME, ,136 (3 ),

Ababneh M.; Chamarthy P.; Chauhan S.; Gerner F. (01-01-2014. )Thermal modeling and experimental validation for high thermal conductivity heat pipe thermal ground .Journal of Heat Transfer, ,136 (11 ),

Ababneh M.; Chamarthy P.; Chauhan S.; De Bock P.; Deng T.; Gerner F. (01-01-2014. )Thermal-fluid modeling for high thermal conductivity heat pipe thermal ground planes.Journal of Thermophysics and Heat Transfer, ,28 (2 ),270-278

Ababneh M.; Gerner F. (12-01-2013. )Fluid flow and capillary limit in heat pipe thermal ground planes.ASME 2013 Heat Transfer Summer Conf. Collocated with the ASME 2013 7th Int. Conf. on Energy Sustainability and the ASME 2013 11th Int. Conf. on Fuel Cell Science, Engineering and Technology, HT 2013, ,3 ,

Ababneh M.; Gerner F. (12-01-2013. )Non-dimensional analysis for the fluid flow in the flat heat pipes.ASME 2013 Heat Transfer Summer Conf. Collocated with the ASME 2013 7th Int. Conf. on Energy Sustainability and the ASME 2013 11th Int. Conf. on Fuel Cell Science, Engineering and Technology, HT 2013, ,3 ,

Ababneh M.; Chauhan S.; De Bock P.; Deng T.; Gerner F.; Hurd D. (01-08-2013. )Charging station of a planar miniature heat pipe thermal ground plane.Journal of Heat Transfer, ,135 (2 ),

Gerner F.; Remella K.; Shuja A. (01-01-2013. )Steady state parametric modeling of non-conventional loop heat pipes.ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), ,8 B ,

Gerner F.; Medis P.; Remella K.; Shuja A. (12-01-2012. )Steady state numerical modeling of non-conventional loop heat pipes (LHPS).ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), ,7 (PARTS A, B, C, D ),1467-1478

Ababneh M.; Chamarthy P.; Chauhan S.; De Bock P.; Deng T.; Gerner F. (12-01-2012. )Thermal modeling for high thermal conductivity thermal ground planes.ASME 2012 Heat Transfer Summer Conf. Collocated with the ASME 2012 Fluids Engineering Div. Summer Meeting and the ASME 2012 10th Int. Conf. on Nanochannels, Microchannels and Minichannels, HT 2012, ,2 ,625-634

Ababneh M.; Bock P.; Chamarthy P.; Chauhan S.; Deng T.; Gerner F. (12-01-2012. )Thermo-fluid model for high thermal conductivity thermal ground planes.ASME 2012 3rd International Conference on Micro/Nanoscale Heat and Mass Transfer, MNHMT 2012, ,929-937

Ababneh M.; Chauhan S.; De Bock P.; Deng T.; Gerner F.; Hurd D. (12-01-2011. )Charging station of a planar miniature thermal ground plane .ASME/JSME 2011 8th Thermal Engineering Joint Conference, AJTEC 2011, ,

Chamarthy P.; Chauhan S.; Courson D.; De Bock H.; Deng T.; Eastman C.; Gerner F.; Johnson D.; Leland Q.; Russ B.; Weaver S.; Whalen B.; Yerkes K. (12-01-2011. )Development and experimental validation of a micro/nano thermal ground plane .ASME/JSME 2011 8th Thermal Engineering Joint Conference, AJTEC 2011, ,

Cytrynowicz D.; Gerner F.; Henderson H.; Suh J. (12-01-2010. )A MEMS bubble pump for an electronic cooling device.Journal of Micromechanics and Microengineering, ,20 (12 ),

Ababneh M.; Chamarthy P.; Chauhan S.; De Bock H.; Deng T.; Gerner F.; Varanasi K.; Weaver S. (08-09-2010. )On the charging and thermal characterization of a micro/nano structured thermal ground plane.2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010, ,

Bickle J.; Burdick J.; Dadhania M.; Gerner F.; Gorton A.; Hoang T.; Iyer S.; Jadhav S.; Mantei T.; Paputsky I.; Schulz M.; Seth G.; Shanov V.; Smith L.; Spatholt A.; Yeo-Heung Y. (12-20-2009. )Vertical integration of nanotechnology education.ACS Symposium Series, ,1010 ,49-64

Chamarthy P.; De Bock H.; Deng T.; Gerner F.; Kulkarni A.; Rush B.; Russ B.; Varanasi K.; Weaver S. (09-21-2009. )Experimental investigation of micro/nano heat pipe wick structures.ASME International Mechanical Engineering Congress and Exposition, Proceedings, ,10 (PART B ),991-996

Abel J.; Barbour C.; Bickle J.; Direnzi C.; Dlesk D.; D'Souza N.; Gerner F.; Gorton A.; Hoang T.; Iyer S.; Jadhav S.; Kier Z.; Mantei T.; Negassi N.; Paputsky I.; Schaub R.; Schulz M.; Seger K.; Shanov V.; Smith L.; Wagner R.; Witt E.; Yun Y. (12-01-2006. )First experiences teaching experimental nanoscale science and technology to undergraduate students .2006 6th IEEE Conference on Nanotechnology, IEEE-NANO 2006, ,1 ,410-413

Gerner F.; Henderson H.; Medis P.; Parimi S.; Shuja A.; Sun J. (02-23-2006. )Operating ranges of the planar loop heat pipe under non-vacuum conditions .Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, ,PART C ,2279-2284

Gerner F.; Henderson H.; Medis P.; Parimi S.; Shuja A.; Suh J. (01-01-2006. )Microfabrication and packaging issues in the development of a planar silicon loop heat pipe, using S .American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, ,

Cytrynowicz D.; Gerner F.; Henderson H.; Medis P.; Suh J. (12-01-2005. )Flow visualization within the evaporator of planar loop heat pipe.AIP Conference Proceedings, ,746 ,195-202

Gerner F.; Henderson H.; Medis P.; Parimi S.; Shuja A.; Suh J. (12-01-2005. )Operating ranges of the planar loop heat pipe under non-vacuum conditions.Proceedings of the ASME Summer Heat Transfer Conference, ,4 ,737-742

Arragattu P.; Gerner F.; Henderson H.; Ponugoti P. (01-01-2004. )Competitive designs of evaporator top cap of the micro loop heat pipe.American Society of Mechanical Engineers, Micro-Electro Mechanical Systems Division, (Publications) MEMS, ,85-97

Gerner F.; Henderson H.; Shuja A.; Suh J. (01-01-2004. )Nucleate boiling inside the evaporator of the planar loop heat pipe.American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, ,375 (3 ),75-83

Gerner F. (01-01-2003. )Heat Transfer in Energy Systems: Introduction .American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, ,374 (2 ),349

Gerner F.; Hamdan M.; Henderson H. (01-01-2003. )Steady state model of a loop heat pipe (LHP) with coherent porous silicon (CPS) wick in the evaporat .Annual IEEE Semiconductor Thermal Measurement and Management Symposium, ,88-96

Gerner F.; Henderson H.; Suh J.; Yang Y. (01-01-2003. )The dynamic characteristics of a liquid-gas interface in microscale pores.American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, ,374 (4 ),247-253

Gerner F.; Thurman Henderson H.; Yang Y. (12-01-2002. )Mathematical and experimental inverstigation of liquid-gas interfaces in porous wicks .American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, ,372 (5 ),169-174

Gerner F.; Henderson H.; Yang Y. (01-01-2002. )Dynamic stability of the liquid-gas interface in micron-sized pores.InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, ,2002-January ,1046-1051

Gerner F.; Henderson H.; Yang Y. (01-01-2002. )Mathematical and experimental inverstigation of liquid-gas interfaces in porous wicks .ASME International Mechanical Engineering Congress and Exposition, Proceedings, ,5 ,169-174

Gerner F.; Thurman Henderson H.; Yang Y. (01-01-2002. )Dynamic stability of the liquid-gas interface in micron-sized pores .Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, ,1046-1051

Cytrynowicz D.; Gerner F.; Golliher E.; Hamdan M.; Henderson H.; Medis P.; Mellott K.; Moore C.; Shuja A. (01-01-2002. )Loop heat pipe (LHP) development by utilizing coherent porous silicon (CPS) wicks.InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, ,2002-January ,457-465

Cytrynowicz D.; Gerner F.; Golliher E.; Hamdan M.; Henderson H.; Medis P.; Mellott K.; Moore C.; Shuja A. (01-01-2002. )Loop Heat Pipe (LHP) development by utilizing coherent porous silicon (CPS) wicks .Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, ,457-465

Gerner F.; Henderson H.; Hölke A.; Kazmierczak M.; Pilchowski J. (01-01-2000. )Development toward an all-silicon integrated thermal management system: The integrated MCM.Microsystem Technologies, ,6 (6 ),222-228

Gerner F.; Henderson H.; Hoelke A.; Kazmierczak M. (12-01-1999. )Analysis of the heat transfer capacity of a micromachined loop heat pipe .American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, ,364-3 ,53-60

Gerner F.; Hazrati A.; Yang Y. (09-01-1999. )Study of the drying process of a product cake in a vibro-separator .Pharmaceutical Engineering, ,19 (5 ),46-54

Gerner F.; Harms T.; Kazmierczak M. (04-01-1999. )Developing convective heat transfer in deep rectangular microchannels.International Journal of Heat and Fluid Flow, ,20 (2 ),149-157

Baker K.; Gerner F.; Henderson H.; Hoike A.; Kazmierczak M.; Pilchowski J.; Saleh A. (12-01-1998. )Coherent macro porous silicon as a wick structure in an integrated microfluidic two-phase cooling sy .Proceedings of SPIE - The International Society for Optical Engineering, ,3515 ,154-162

Gerner F.; Harms T.; Henderson H.; Holke A.; Kazmierczak M.; Pilchowski J. (01-01-1998. )All silicon multi chip module with a fully integrated cooling system.Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging, ,1998-April ,155-159

Baker K.; Gerner F.; Harms T.; Henderson H.; Hölke A.; Kazmierczak M.; Pilchowski J. (12-01-1997. )Experimental investigation of heat transfer and pressure drop through deep microchannels in A (110) .American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, ,351 ,347-357

Albayyari J.; Bentz M.; Gerner F. (01-01-1997. )Axial jet-induced mixing in low gravity: Results of the Reduced-Fill Tank Pressure Control Experimen.Journal of Flow Visualization and Image Processing, ,4 (1 ),29-39

Badran B.; Baker K.; Gerner F.; Henderson T.; Ramadas P. (01-01-1997. )Experimental results for low-temperature silicon micromachined micro heat pipe arrays using water an.Experimental Heat Transfer, ,10 (4 ),253-272

Gerner F.; Khatri N.; Moskal T.; Ziels B. (01-01-1995. )Thermo-fluid analysis and testing of a pneumatic port cleaner.Journal of Manufacturing Science and Engineering, Transactions of the ASME, ,117 (1 ),28-32

Gerner F.; Khatri N.; Moskal T.; Ziels B. (01-01-1995. )Thermo-fluid analysis and testing of a pneumatic port cleaner.Journal of engineering for industry, ,117 (1 ),28-32

Badran B.; Gerner F.; Longtin J. (01-01-1994. )A one-dimensional model of a micro heat pipe during steady- state operation.Journal of Heat Transfer, ,116 (3 ),709-715

Gerner F.; Ma S. (01-01-1993. )Forced convection heat transfer from microstructures.Journal of Heat Transfer, ,115 (4 ),872-880

Brown M.; Gerner F.; Khatri N. (01-01-1993. )Using fiber optics to tap the sun's power.International Communications in Heat and Mass Transfer, ,20 (6 ),771-781

Albayyari J.; Badran B.; Baker K.; Gerner F.; Henderson H.; Ramadas P. (01-01-1993. )Liquid-metal micro heat pipes .American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, ,236 ,71-85

Gerner F.; Ma S.; Tsuei Y. (12-01-1992. )Forced convection heat transfer from microstructures .American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, ,200 ,35-43

Badran B.; Gerner F.; Longtin J. (12-01-1992. )One-dimensional model of a micro heat pipe during steady-state operation .American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, ,200 ,23-33

Chang W.; Gerner F.; Henderson H.; Hsieh W.; Longtin J.; Ramadas P. (12-01-1992. )Flow and heat transfer limitations in micro heat pipes .American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, ,206-3 ,99-104

Gerner F.; Ma S.; Tsuei Y. (01-01-1992. )Composite expansions on forced convection over a flat plate with an unheated starting length.International Journal of Heat and Mass Transfer, ,35 (12 ),3275-3289

Brown M.; Gerner F.; Khatri N. (12-01-1990. )A solar energy collection system using optical fibers and a two-stage concentrator .Proceedings of the Intersociety Energy Conversion Engineering Conference, ,5 ,173-178

Gerner F.; Tien C. (01-01-1990. )Multi-component interfacial condensation.International Journal of Heat and Mass Transfer, ,33 (10 ),2111-2120

Brown M.; Gerner F.; Khatri N. (01-01-1990. )Solar furnace utilizing optical fibers and compound parabolic concentrators .389-396

Gerner F.; Tien C. (01-01-1989. )Axisymmetric interfacial condensation model.Journal of Heat Transfer, ,111 (2 ),503-510

Gerner F.; Tien C. (12-01-1988. )Axisymmetric interfacial condensation model .American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, ,96 ,235-242

Gerner F.; Reed J.; Tien C. (01-01-1988. )Transient laminar-film condensation on a vertical plate.Journal of Thermophysics and Heat Transfer, ,2 (3 ),257-263

Gerner F.; Tong T. (01-01-1987. )Natural Convection in Partitioned Air-Filled Rectangular Enclosures.Journal of Thermal Envelope and Building Science, ,10 (3 ),189-196

Gerner F.; Reed J.; Tien C. (01-01-1987. )Transient condensation of a laminar film onto a vertical plate .AIAA 22nd Thermophysics Conference, 1987, ,

Chen S.; Gerner F.; Tien C. (01-01-1987. )General film condensation correlations.Experimental Heat Transfer, ,1 (2 ),93-107

Gerner F.; Tong T. (01-01-1986. )Natural convection in partitioned air-filled rectangular enclosures.International Communications in Heat and Mass Transfer, ,13 (1 ),99-108