Frank Gerner

Frank M Gerner

Senior Associate Dean

Senior Associate Dean

Research Support

Grant: #C-80063-A Investigators:Gerner, Frank 06-03-2003 -12-31-2003 National Aeronautics and Space Administration Micro Loop Heat Pipe Section Role:PI $79,999.00 Closed Level:Federal

Grant: #C80075A Investigators:Gerner, Frank 06-03-2003 -12-31-2003 National Aeronautics and Space Administration Interconnected Coherent Porous Silicon Role:PI $29,998.00 Closed Level:Federal

Grant: #NNC04CB44C INT.NCE Investigators:Gerner, Frank 09-03-2004 -03-31-2007 National Aeronautics and Space Administration Proof of Concept Micro Loop Pipe Role:PI $130,000.00 Closed Level:Federal

Grant: #L-14449 Investigators:Gerner, Frank 06-01-2001 -09-30-2001 National Aeronautics and Space Administration Development of Coherent Porous Silicon for a Loop Hear Pipe Role:PI $44,999.00 Closed Level:Federal

Grant: #SRS 5462 Investigators:Gerner, Frank 02-15-2008 -11-15-2011 Defense Advanced Research Projects Agency Thermal Ground Plane (TGP) Proposal Role:PI $172,099.00 Closed Level:Federal

Grant: #S007 Investigators:Gerner, Frank; Lim, Teik; Liu, Yijun 01-04-2010 -12-31-2011 TechnoSoft, Inc. Co-op Assignments at Technosoft Role:PI $225,000.00 Closed Level:Industry

Grant: #SRS 005781 Investigators:Gerner, Frank; Lim, Teik; Liu, Yijun 09-01-2008 -01-31-2018 Procter & Gamble Company High Performance Modeling and Simulation Center Role:PI $12,561,000.00 Active Level:Industry

Grant: #SRS 11017 Investigators:Gerner, Frank 10-05-2008 -05-01-2019 Procter & Gamble Company Procter & Gamble Simulation Center Master Agreement Role:PI $.00 Active Level:Industry

Grant: #Edaptive Master Agreement Investigators:Bhatnagar, Raj; Gerner, Frank 02-01-2018 -01-31-2025 EDAptive Computing, Incorporated Edaptive Computing Master Alliance Agreement Role:Collaborator $.00 Active Level:Industry

Grant: #Exh A-6 SETS02-UC/MAA-2018 - FA8650-14-D-1724/0002 Investigators:Bhatnagar, Raj; Gerner, Frank; Niu, Nan 05-26-2019 -08-24-2019 Air Force Research Laboratory Exhibit A-6: Application and research into Using SYSML as basis for vulnerability assessment Role:Collaborator $21,868.00 Awarded Level:Federal

Grant: #Exh A-7 STAMP01-UC/MAA-2018 / FA8650-18-F-1613 Investigators:Bhatnagar, Raj; Gerner, Frank; Minai, Ali 05-26-2019 -08-24-2019 Air Force Research Laboratory Exhibit A-7: Application and research into using ML analytics to evaluate/improve verification test processes and results Role:Collaborator $40,245.00 Awarded Level:Federal

Grant: #MASTER AGREEMENT - ECI Data Analytics and Cybersecurity Simulation Cen Investigators:Bhatnagar, Raj; Gerner, Frank 06-01-2019 -05-31-2024 EDAptive Computing, Incorporated MASTER AGREEMENT - ECI Data Analytics and Cybersecurity Simulation Center Role:Collaborator 0.00 Hold Level:Industry

Grant: #FII Master Service Agreement Investigators:Gerner, Frank 01-01-2020 -12-31-2020 Foxconn Industrial Internet Foxconn Industrial Internet MSA Role:PI 0.00 Hold Level:Industry

Grant: #Foxconn Industrial Internet MSA - Exhibit A - Task Order 001 Investigators:Gerner, Frank; Kim, Jay 01-01-2020 -12-31-2020 Foxconn Industrial Internet Foxconn Industrial Internet MSA - Exhibit A - Task Order 001 Role:Collaborator 200000.00 Hold Level:Industry

Grant: #2019 Facility Use Agreement_FII Investigators:Gerner, Frank 01-01-2020 -12-31-2030 Foxconn Industrial Internet Facilities Use Agreement Role:PI 0.00 Hold Level:Industry

03-01-2022 -03-01-2027 General Electric Aviation Prepare GE Master Agreement Role:PI 0.00 Hold Level:Industry

03-01-2022 -03-01-2027 General Electric Aviation Prepare GE Master Agreement Role:PI 0.00 Hold Level:Industry

Publications

Peer Reviewed Publications

Remella K.;Gerner F. (07-25-2017. ) Parametric study of liquid-vapor interface within a woven metallic wire mesh screen.Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017, , 155-163 More Information

Remella K.;Gerner F. (04-01-2017. ) Simplified Mathematical Model of a novel ‘Closed Loop Two-Phase Wicked Thermosyphon (CLTPWT)’.International Journal of Thermal Sciences, , 114 ,281-295 More Information

Remella K.;Gerner F. (01-01-2017. ) False transient evaporator thermal model of the 'Closed Loop Two-Phase Wicked Thermosyphon (CLTPWT)'.Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering, , More Information

Remella K.;Gerner F. (04-22-2016. ) In-plane effective thermal conductivity of a single layered metallic wire-mesh screen.Annual IEEE Semiconductor Thermal Measurement and Management Symposium, , Part F121464 ,57-65 More Information

Paul R.;Anand S.;Gerner F. (01-01-2014. ) Effect of thermal deformation on part errors in metal powder based additive manufacturing processes.Journal of Manufacturing Science and Engineering, Transactions of the ASME, , 136 (3 ) , More Information

Ababneh M.;Chauhan S.;Chamarthy P.;Gerner F. (01-01-2014. ) Thermal modeling and experimental validation for high thermal conductivity heat pipe thermal ground .Journal of Heat Transfer, , 136 (11 ) , More Information

Ababneh M.T.;Gerner F.M.;Chamarthy P.;De Bock P.;Chauhan S.;Deng T. (01-01-2014. ) Thermal-fluid modeling for high thermal conductivity heat pipe thermal ground planes.Journal of Thermophysics and Heat Transfer, , 28 (2 ) ,270-278 More Information

Ababneh M.;Gerner F. (12-01-2013. ) Fluid flow and capillary limit in heat pipe thermal ground planes.ASME 2013 Heat Transfer Summer Conf. Collocated with the ASME 2013 7th Int. Conf. on Energy Sustainability and the ASME 2013 11th Int. Conf. on Fuel Cell Science, Engineering and Technology, HT 2013, , 3 , More Information

Ababneh M.;Gerner F. (12-01-2013. ) Non-dimensional analysis for the fluid flow in the flat heat pipes.ASME 2013 Heat Transfer Summer Conf. Collocated with the ASME 2013 7th Int. Conf. on Energy Sustainability and the ASME 2013 11th Int. Conf. on Fuel Cell Science, Engineering and Technology, HT 2013, , 3 , More Information

Ababneh M.;Chauhan S.;Gerner F.;Hurd D.;De Bock P.;Deng T. (01-08-2013. ) Charging station of a planar miniature heat pipe thermal ground plane.Journal of Heat Transfer, , 135 (2 ) , More Information

Remella K.;Gerner F.;Shuja A. (01-01-2013. ) Steady state parametric modeling of non-conventional loop heat pipes.ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), , 8 B , More Information

Remella K.;Gerner F.;Shuja A.;Medis P. (12-01-2012. ) Steady state numerical modeling of non-conventional loop heat pipes (LHPS).ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), , 7 (PARTS A, B, C, D ) ,1467-1478 More Information

Ababneh M.;Chamarthy P.;Chauhan S.;Gerner F.;De Bock P.;Deng T. (12-01-2012. ) Thermal modeling for high thermal conductivity thermal ground planes.ASME 2012 Heat Transfer Summer Conf. Collocated with the ASME 2012 Fluids Engineering Div. Summer Meeting and the ASME 2012 10th Int. Conf. on Nanochannels, Microchannels and Minichannels, HT 2012, , 2 ,625-634 More Information

Ababneh M.;Gerner F.;Chamarthy P.;Bock P.;Chauhan S.;Deng T. (12-01-2012. ) Thermo-fluid model for high thermal conductivity thermal ground planes.ASME 2012 3rd International Conference on Micro/Nanoscale Heat and Mass Transfer, MNHMT 2012, , 929-937 More Information

Ababneh M.;Gerner F.;Hurd D.;De Bock P.;Chauhan S.;Deng T. (12-01-2011. ) Charging station of a planar miniature thermal ground plane .ASME/JSME 2011 8th Thermal Engineering Joint Conference, AJTEC 2011, ,

De Bock H.P.J.;Chauhan S.;Chamarthy P.;Eastman C.;Weaver S.;Whalen B.P.;Deng T.;Russ B.;Gerner F.M.;Johnson D.;Courson D.;Leland Q.;Yerkes K. (12-01-2011. ) Development and experimental validation of a micro/nano thermal ground plane .ASME/JSME 2011 8th Thermal Engineering Joint Conference, AJTEC 2011, ,

Suh J.;Cytrynowicz D.;Gerner F.;Henderson H. (12-01-2010. ) A MEMS bubble pump for an electronic cooling device.Journal of Micromechanics and Microengineering, , 20 (12 ) , More Information

De Bock H.;Chauhan S.;Chamarthy P.;Weaver S.;Deng T.;Gerner F.;Ababneh M.;Varanasi K. (08-09-2010. ) On the charging and thermal characterization of a micro/nano structured thermal ground plane.2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010, , More Information

Shanov V.N.;Yeo-Heung Y.;Smith L.;Jadhav S.;Hoang T.B.;Gorton A.;Mantei T.;Bickle J.;Paputsky I.;Gerner F.;Burdick J.L.;Spatholt A.;Dadhania M.;Seth G.;Schulz M.J.;Iyer S.S. (12-20-2009. ) Vertical integration of nanotechnology education.ACS Symposium Series, , 1010 ,49-64 More Information

De Bock H.;Varanasi K.;Chamarthy P.;Deng T.;Kulkarni A.;Rush B.;Russ B.;Weaver S.;Gerner F. (09-21-2009. ) Experimental investigation of micro/nano heat pipe wick structures.ASME International Mechanical Engineering Congress and Exposition, Proceedings, , 10 (PART B ) ,991-996 More Information

Shanov V.;Yun Y.H.;Smith L.;Iyer S.S.;Jadhav S.;Hoang T.B.;Gorton A.;Schulz M.;Mantei T.;Abel J.;Barbour C.;D'Souza N.;Direnzi C.;Dlesk D.;Kier Z.;Negassi N.;Schaub R.;Seger K.;Wagner R.;Witt E.;Bickle J.;Paputsky I.;Gerner F. (12-01-2006. ) First experiences teaching experimental nanoscale science and technology to undergraduate students .2006 6th IEEE Conference on Nanotechnology, IEEE-NANO 2006, , 1 ,410-413

Sun J.;Medis P.;Gerner F.;Shuja A.;Parimi S.;Henderson H. (02-23-2006. ) Operating ranges of the planar loop heat pipe under non-vacuum conditions .Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, , PART C ,2279-2284

Medis P.;Shuja A.;Suh J.;Parimi S.;Henderson H.;Gerner F. (01-01-2006. ) Microfabrication and packaging issues in the development of a planar silicon loop heat pipe, using S .American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, ,

Suh J.;Cytrynowicz D.;Medis P.;Gerner F.;Henderson H. (12-01-2005. ) Flow visualization within the evaporator of planar loop heat pipe.AIP Conference Proceedings, , 746 ,195-202 More Information

Suh J.;Medis P.;Gerner F.;Shuja A.;Parimi S.;Henderson H. (12-01-2005. ) Operating ranges of the planar loop heat pipe under non-vacuum conditions.Proceedings of the ASME Summer Heat Transfer Conference, , 4 ,737-742 More Information

Arragattu P.;Ponugoti P.;Gerner F.;Henderson H. (01-01-2004. ) Competitive designs of evaporator top cap of the micro loop heat pipe.American Society of Mechanical Engineers, Micro-Electro Mechanical Systems Division, (Publications) MEMS, , 85-97 More Information

Suh J.;Shuja A.;Gerner F.;Henderson H. (01-01-2004. ) Nucleate boiling inside the evaporator of the planar loop heat pipe.American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, , 375 (3 ) ,75-83 More Information

Gerner F. (01-01-2003. ) Heat Transfer in Energy Systems: Introduction .American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, , 374 (2 ) ,349

Hamdan M.;Gerner F.;Henderson H. (01-01-2003. ) Steady state model of a loop heat pipe (LHP) with coherent porous silicon (CPS) wick in the evaporat .Annual IEEE Semiconductor Thermal Measurement and Management Symposium, , 88-96

Suh J.;Gerner F.;Yang Y.;Henderson H. (01-01-2003. ) The dynamic characteristics of a liquid-gas interface in microscale pores.American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, , 374 (4 ) ,247-253 More Information

Yang Y.;Gerner F.;Thurman Henderson H. (12-01-2002. ) Mathematical and experimental inverstigation of liquid-gas interfaces in porous wicks .American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, , 372 (5 ) ,169-174

Yang Y.;Gerner F.;Henderson H. (01-01-2002. ) Dynamic stability of the liquid-gas interface in micron-sized pores.InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, , 2002-January ,1046-1051 More Information

Yang Y.;Gerner F.;Henderson H. (01-01-2002. ) Mathematical and experimental inverstigation of liquid-gas interfaces in porous wicks .ASME International Mechanical Engineering Congress and Exposition, Proceedings, , 5 ,169-174

Yang Y.;Gerner F.;Thurman Henderson H. (01-01-2002. ) Dynamic stability of the liquid-gas interface in micron-sized pores .Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, , 1046-1051

Hamdan M.;Cytrynowicz D.;Medis P.;Shuja A.;Gerner F.;Henderson H.;Golliher E.;Mellott K.;Moore C. (01-01-2002. ) Loop heat pipe (LHP) development by utilizing coherent porous silicon (CPS) wicks.InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, , 2002-January ,457-465 More Information

Hamdan M.;Cytrynowicz D.;Medis P.;Shuja A.;Gerner F.;Henderson H.;Golliher E.;Mellott K.;Moore C. (01-01-2002. ) Loop Heat Pipe (LHP) development by utilizing coherent porous silicon (CPS) wicks .Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, , 457-465

Pilchowski J.;Hölke A.;Henderson H.;Kazmierczak M.;Gerner F. (01-01-2000. ) Development toward an all-silicon integrated thermal management system: The integrated MCM.Microsystem Technologies, , 6 (6 ) ,222-228 More Information

Hoelke A.;Henderson H.;Gerner F.;Kazmierczak M. (12-01-1999. ) Analysis of the heat transfer capacity of a micromachined loop heat pipe .American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, , 364-3 ,53-60

Yang Y.;Gerner F.;Hazrati A. (09-01-1999. ) Study of the drying process of a product cake in a vibro-separator .Pharmaceutical Engineering, , 19 (5 ) ,46-54

Harms T.M.;Kazmierczak M.J.;Gerner F.M. (04-01-1999. ) Developing convective heat transfer in deep rectangular microchannels.International Journal of Heat and Fluid Flow, , 20 (2 ) ,149-157 More Information

Hoike A.;Pilchowski J.;Henderson H.;Saleh A.;Kazmierczak M.;Gerner F.;Baker K. (12-01-1998. ) Coherent macro porous silicon as a wick structure in an integrated microfluidic two-phase cooling sy .Proceedings of SPIE - The International Society for Optical Engineering, , 3515 ,154-162

Pilchowski J.;Holke A.;Henderson H.;Harms T.;Kazmierczak M.;Gerner F. (01-01-1998. ) All silicon multi chip module with a fully integrated cooling system.Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging, , 1998-April ,155-159 More Information

Harms T.;Kazmierczak M.;Gerner F.;Hölke A.;Henderson H.;Pilchowski J.;Baker K. (12-01-1997. ) Experimental investigation of heat transfer and pressure drop through deep microchannels in A (110) .American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, , 351 ,347-357

Albayyari J.;Gerner F.;Bentz M. (01-01-1997. ) Axial jet-induced mixing in low gravity: Results of the Reduced-Fill Tank Pressure Control Experimen.Journal of Flow Visualization and Image Processing, , 4 (1 ) ,29-39 More Information

Badran B.;Gerner F.;Ramadas P.;Henderson T.;Baker K. (01-01-1997. ) Experimental results for low-temperature silicon micromachined micro heat pipe arrays using water an.Experimental Heat Transfer, , 10 (4 ) ,253-272 More Information

Khatri N.;Gerner F.;Ziels B.;Moskal T. (01-01-1995. ) Thermo-fluid analysis and testing of a pneumatic port cleaner.Journal of Manufacturing Science and Engineering, Transactions of the ASME, , 117 (1 ) ,28-32 More Information

Khatri N.;Gerner F.;Ziels B.;Moskal T. (01-01-1995. ) Thermo-fluid analysis and testing of a pneumatic port cleaner.Journal of engineering for industry, , 117 (1 ) ,28-32 More Information

Longtin J.;Badran B.;Gerner F. (01-01-1994. ) A one-dimensional model of a micro heat pipe during steady- state operation.Journal of Heat Transfer, , 116 (3 ) ,709-715 More Information

Ma S.;Gerner F. (01-01-1993. ) Forced convection heat transfer from microstructures.Journal of Heat Transfer, , 115 (4 ) ,872-880 More Information

Khatri N.;Brown M.;Gerner F. (01-01-1993. ) Using fiber optics to tap the sun's power.International Communications in Heat and Mass Transfer, , 20 (6 ) ,771-781 More Information

Badran B.;Albayyari J.;Gerner F.;Ramadas P.;Henderson H.;Baker K. (01-01-1993. ) Liquid-metal micro heat pipes .American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, , 236 ,71-85

Ma S.;Gerner F.;Tsuei Y. (12-01-1992. ) Forced convection heat transfer from microstructures .American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, , 200 ,35-43

Longtin J.;Badran B.;Gerner F. (12-01-1992. ) One-dimensional model of a micro heat pipe during steady-state operation .American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, , 200 ,23-33

Gerner F.;Longtin J.;Henderson H.;Hsieh W.;Ramadas P.;Chang W. (12-01-1992. ) Flow and heat transfer limitations in micro heat pipes .American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, , 206-3 ,99-104

Ma S.;Gerner F.;Tsuei Y. (01-01-1992. ) Composite expansions on forced convection over a flat plate with an unheated starting length.International Journal of Heat and Mass Transfer, , 35 (12 ) ,3275-3289 More Information

Khatri N.;Brown M.;Gerner F. (12-01-1990. ) A solar energy collection system using optical fibers and a two-stage concentrator .Proceedings of the Intersociety Energy Conversion Engineering Conference, , 5 ,173-178

Gerner F.;Tien C. (01-01-1990. ) Multi-component interfacial condensation.International Journal of Heat and Mass Transfer, , 33 (10 ) ,2111-2120 More Information

Khatri N.;Brown M.;Gerner F. (01-01-1990. ) Solar furnace utilizing optical fibers and compound parabolic concentrators .389-396

Gerner F.;Tien C. (01-01-1989. ) Axisymmetric interfacial condensation model.Journal of Heat Transfer, , 111 (2 ) ,503-510 More Information

Gerner F.M.;Tien C.L. (12-01-1988. ) Axisymmetric interfacial condensation model .American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, , 96 ,235-242

Reed J.G.;Gerner F.M.;Tien C.L. (01-01-1988. ) Transient laminar-film condensation on a vertical plate.Journal of Thermophysics and Heat Transfer, , 2 (3 ) ,257-263 More Information

Tong T.;Gerner F. (01-01-1987. ) Natural Convection in Partitioned Air-Filled Rectangular Enclosures.Journal of Thermal Envelope and Building Science, , 10 (3 ) ,189-196 More Information

Reed J.;Gerner F.;Tien C. (01-01-1987. ) Transient condensation of a laminar film onto a vertical plate .AIAA 22nd Thermophysics Conference, 1987, ,

Chen S.;Gerner F.;Tien C. (01-01-1987. ) General film condensation correlations.Experimental Heat Transfer, , 1 (2 ) ,93-107 More Information

Tong T.;Gerner F. (01-01-1986. ) Natural convection in partitioned air-filled rectangular enclosures.International Communications in Heat and Mass Transfer, , 13 (1 ) ,99-108 More Information